WHY THIS ROUTE
Designed around the complete process interface.
- Stable workpiece location without wax
- Contact and release behaviour reviewed together
- Pad direction validated with the actual substrate
Waxless holding
Adsorption & Holding Pads
Waxless holding directions for stable location, protected contact and controlled release during processing.
FIRST REVIEW
Information that moves engineering forward.
- Workpiece size, material and thickness
- Holding surface and equipment
- Liquid exposure and release method
- Flatness, marking and breakage concern
APPLICATION FIT
Typical directions to explore.
- Thin wafers
- Optical substrates
- Sensitive precision parts
PRODUCT FAMILY STORY
Custom-made around the job—not selected from a fixed shelf.
Waxless holding pads locate thin workpieces through the complete wet cycle. Holding, flatness, liquid exposure, release and cleaning must be reviewed together so stable location does not become difficult release or marking.Within this family
- Waxless wafer-holding pads
- Porous and application-specific contact layers
- Machine-sized holding discs
- Custom layouts for thin and fragile substrates
Design focus
- Workpiece size, thickness and backside condition
- Holding and release behaviour
- Liquid exposure and cleaning
- Flatness, marking and breakage risk
VALIDATION & RESULT FOCUS
Build evidence before making a production promise.
Every application is reviewed against its own machine, material, process and acceptance method. These are the evidence points normally carried into the next decision.- 01Holding-and-release trial
- 02Backside contact inspection
- 03Documented cleaning and reuse route
ENGINEERING DEFINITION
Four connected decisions before a repeatable product.
Define the machine interface
Confirm plate size, carrier OD, inner and outer gearing, tooth data, motion, load and liquid delivery.Protect the workpiece
Review workpiece material, pocket shape, clearance, thickness, orientation and every possible edge-contact point.Match material and chemistry
Connect strength, wear, acid/alkali resistance, corrosion, metal-ion risk, slurry and cleaning requirements.Validate the route
Agree first-article measurements, acceptance evidence, change control and the path toward repeat supply.DRAWING & DESIGN INPUTS
What the product page cannot safely assume.
These fields turn a general product enquiry into a controlled engineering review. Share what is available; missing inputs can be structured together.- Geometry
- OD, tooth count, module or DP, pitch circle, pocket geometry, thickness and datum
- Workpiece
- Material, size, finished thickness, quantity, orientation and protected surfaces
- Process
- Single- or double-side route, speed, pressure, slurry, temperature and cleaning sequence
- Acceptance
- Flatness, parallelism, TTV, finish, edge condition, contamination and service-life method
ENGINEERING & KNOWLEDGE ROUTES
Continue from product choice to the relevant review.
MATCHED CONSUMABLES
Review the neighbouring interfaces with this product.
PU Polishing PadsGroove, hardness, pore and liquid-retention directions selected around contact stability and target finish.
Epoxy & Resin CarriersApplication-led polymer and laminated carrier directions for contact-sensitive workholding and process development.
Slurries, Compounds & AbrasivesFormulation-led polishing media matched to substrate, contact tool, delivery mode and target surface.PRODUCT REVIEW FAQ
Useful answers before sending the first drawing.
Is a drawing required?+
A controlled drawing is the fastest route. If none exists, share the sample, machine and gear data, workpiece dimensions and process target so a reviewable design direction can be prepared.
How is carrier pocket clearance defined?+
It is application-specific. A +0.2–0.3 mm diametral allowance is a common discussion starting point, then material, loading, liquid film, temperature and edge risk determine the final drawing.
Can material be recommended?+
Yes. Blue steel, stainless steel, resin, engineering plastic and composite-insert directions are compared against stiffness, wear, chemistry, contamination and contact protection.
What confirms production readiness?+
The agreed drawing, measured first article, application trial and acceptance method form the release baseline. Final feasibility remains process- and validation-specific.
FROM REQUIREMENT TO REPEAT SUPPLY