APPLICATION
Aluminum Nitride Ceramic Finishing
- Brittle-edge protection
- Contamination-aware material choice
- Flatness and surface consistency
AlN
Aluminum Nitride Ceramic Finishing
Stable support and contamination-aware wet finishing for thin thermal and electronic ceramic substrates.
PRODUCT AVAILABILITY
Custom products for the application.
- Multiple product families
- Custom materials and dimensions
- Quotation from drawing, sample or requirement
SUPPLY SUPPORT
From samples to repeat orders.
- Global quotation support
- Sample and project communication
- Repeat-order supply
RELATED CONSUMABLE DIRECTIONS
Products to review as one application-matched system.
Epoxy & Resin CarriersApplication-led polymer and laminated carrier directions for contact-sensitive workholding and process development.
PU Polishing PadsGroove, hardness, pore and liquid-retention directions selected around contact stability and target finish.
Slurries, Compounds & AbrasivesFormulation-led polishing media matched to substrate, contact tool, delivery mode and target surface.AVAILABLE PRODUCT TYPES
Products that may suit this application.
Final material, dimensions and configuration are confirmed for the order.NWS-POL-3204NWS-POL-3204 Acidic Silica Slurry for AlN CeramicsAcidic Silica Slurry for AlN Ceramics for aluminum nitride ceramic substrates. Fine polishing. Abrasive: Silicon dioxide; Particle-size reference: 60–80 nm. Custom-made for the agreed process.View product →Stainless / PHStainless & Precipitation-Hardening CarriersCorrosion-aware metal carrier directions for wet lapping and polishing environments.View product →Engineering polymerPEEK, PI, PPS & PEI Carrier DirectionsEngineering-polymer carrier directions screened around temperature, chemistry, stiffness, wear and workpiece contact.View product →Machine family16DP–32B Large-Machine Carrier ReferencesA large-format review route covering 16DP/S, 17B, 18B/S, 20B, 22B, 24B, 30B and 32B references.View product →Groove geometryRadial-Groove Lapping PlatesRadial channel layouts developed for liquid transport and debris evacuation on the specific plate and machine.View product →
APPLICATION QUOTATION
Send the product name, drawing or sample photo.
Request a quote →WORKPIECE & PROCESS FIT
AlN ceramic substrate lapping
Aluminum nitride ceramic substrates, discs, rings and thermal-management components.- What to specify
- Ceramic grade, thickness, porosity, face geometry and fluid compatibility; assess the surface before metallization or bonding.
- Made-to-order consumables
- Carrier geometry and material, plate grooves, pad contact properties, conditioning, cleaning and polishing media are reviewed for the actual process. Drawing review and first-article support establish the repeat-order specification.