Si · Silicon

Silicon Wafer Finishing

Machine-matched workholding and chemistry-aware contact for controlled single- or double-side wafer finishing.

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Application visual: Si · Silicon material blanks — Application material visual

APPLICATION

Silicon Wafer Finishing

Thin-wafer support
Flatness and thickness control
Clean, repeatable contact

PRODUCT AVAILABILITY

Custom products for the application.

Multiple product families
Custom materials and dimensions
Quotation from drawing, sample or requirement

SUPPLY SUPPORT

From samples to repeat orders.

Global quotation support
Sample and project communication
Repeat-order supply

AVAILABLE PRODUCT TYPES

Products that may suit this application.

Final material, dimensions and configuration are confirmed for the order.

NWS-MTC-2101NWS-MTC-2101 Thin Blue-Steel Lapping CarriersThin Blue-Steel Lapping Carriers for thin wafers, quartz and optical glass. Double-sided lapping. Material: Blue steel; Thickness capability: From 0.05 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-MTC-2102NWS-MTC-2102 Stainless-Steel Wafer CarriersStainless-Steel Wafer Carriers for wafers, quartz and optical components. Double-sided lapping / polishing. Material: Stainless steel; grade selected for the process; Thickness capability: From 0.05 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-CMC-2101NWS-CMC-2101 Metal and Epoxy Composite CarriersMetal and Epoxy Composite Carriers for wafers and precision optical parts. Double-sided lapping / polishing. Construction: Blue-steel or stainless-steel body with epoxy contact inserts; Thickness capability: From 0.25 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-LGP-2102NWS-LGP-2102 Grey-Iron Lapping PlatesGrey-Iron Lapping Plates for wafers, glass and precision parts. Lapping. Material grade: HT250 grey iron; Dimensions: Diameter, thickness, mounting and grooves to drawing. Custom-made for the agreed process.View product →NWS-CDT-2101NWS-CDT-2101 Drawing-Controlled Conditioning WheelsDrawing-Controlled Conditioning Wheels for lapping plate surfaces. Plate conditioning. Material options: QT600 ductile iron / HT250 grey iron / 45-grade steel; Geometry: Drawing-controlled contact face, thickness and mounting. Custom-made for the agreed process.View product →NWS-PAD-2302NWS-PAD-2302 Nonwoven Wafer Pre-Polishing PadsNonwoven Wafer Pre-Polishing Pads for sic, gaas, silicon, sapphire and metal. Initial polishing. Thickness: 0.8–4.0 mm; Hardness: Shore A 35–92. Custom-made for the agreed process.View product →NWS-PAD-2303NWS-PAD-2303 Compliant Final-Polishing ClothCompliant Final-Polishing Cloth for sic, gaas, silicon, sapphire and glass. Final polishing. Thickness: 0.5–2.0 mm; Hardness: Shore A 32–65. Custom-made for the agreed process.View product →NWS-PAD-2501NWS-PAD-2501 Synthetic-Fibre Pads for Wafer LappingSynthetic-Fibre Pads for Wafer Lapping for sic, gan, gaas, inp, silicon and optical glass. Lapping / polishing. Typical thickness: 1.30 mm; Typical density: 0.43 g/cm³. Custom-made for the agreed process.View product →NWS-HLD-2101NWS-HLD-2101 Waxless Wafer Support PadsWaxless Wafer Support Pads for silicon, sapphire and compound-semiconductor wafers. Wafer holding. Typical thickness: 0.58 mm; Typical density: 0.57 g/cm³. Custom-made for the agreed process.View product →NWS-POL-3403NWS-POL-3403 Colloidal Silica Wafer-Polishing GradesColloidal Silica Wafer-Polishing Grades for semiconductor wafers and compatible precision surfaces. Fine polishing. Abrasive: Colloidal silica; Particle-size options: 80 / 100 / 120 nm. Custom-made for the agreed process.View product →NWS-POL-3501NWS-POL-3501 Silica Slurry for Intermediate Silicon PolishingSilica Slurry for Intermediate Silicon Polishing for silicon wafers. Intermediate polishing. Abrasive: Colloidal silica; Particle-size reference: 76.42 nm. Custom-made for the agreed process.View product →NWS-POL-3502NWS-POL-3502 Silica Slurry for Final Silicon PolishingSilica Slurry for Final Silicon Polishing for silicon wafers. Fine polishing. Abrasive: Colloidal silica; Particle-size reference: 66.72 nm. Custom-made for the agreed process.View product →NWS-POL-3701NWS-POL-3701 Silica Grades for POLY CMPSilica Grades for POLY CMP for polysilicon films. CMP. Abrasive: Colloidal silica; Typical D50: Approximately 50 nm. Custom-made for the agreed process.View product →NWS-POL-3702NWS-POL-3702 Ceria Grades for STI CMPCeria Grades for STI CMP for oxide / nitride isolation structures. CMP. Abrasive: Cerium oxide; Typical D50: 85 nm. Custom-made for the agreed process.View product →Blue steelBlue-Steel Thin Workpiece CarriersThin single-sheet carriers for applications that need a stiff machine interface and drawing-controlled pockets.View product →Stainless / PHStainless & Precipitation-Hardening CarriersCorrosion-aware metal carrier directions for wet lapping and polishing environments.View product →Machine family7DP–16B Lapping Carrier ReferencesA medium-machine review route covering common 7DP, 9B/DP/S, 10.5B, 11DP, 12B/DP/S, 13-series, 14DP, 15-series and 16B references.View product →Machine family16DP–32B Large-Machine Carrier ReferencesA large-format review route covering 16DP/S, 17B, 18B/S, 20B, 22B, 24B, 30B and 32B references.View product →

APPLICATION QUOTATION

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WORKPIECE & PROCESS FIT

Silicon wafer lapping and substrate polishing

Bare silicon substrates, thin wafers and silicon precision parts.

What to specify: Diameter, thickness, edge profile, orientation, TTV and starting surface; distinguish substrate preparation from patterned-device CMP.
Made-to-order consumables: Carrier geometry and material, plate grooves, pad contact properties, conditioning, cleaning and polishing media are reviewed for the actual process. Drawing review and first-article support establish the repeat-order specification.