APPLICATION
Silicon Carbide Substrate Finishing
- Controlled removal on a very hard substrate
- Scratch and subsurface-damage reduction
- Stable consumable life
SiC
Silicon Carbide Substrate Finishing
A hard-material programme that aligns carrier, plate, diamond abrasive, cleaning and inspection around the required surface.
PRODUCT AVAILABILITY
Custom products for the application.
- Multiple product families
- Custom materials and dimensions
- Quotation from drawing, sample or requirement
SUPPLY SUPPORT
From samples to repeat orders.
- Global quotation support
- Sample and project communication
- Repeat-order supply
RELATED CONSUMABLE DIRECTIONS
Products to review as one application-matched system.
Composite Lapping CarriersA precision metal drive body with engineered polymer contact zones for sensitive, brittle or high-value workpieces.
Lapping & Grinding PlatesPlate materials, groove patterns and abrasive routes matched to removal behaviour, slurry transport and target surface.
Cleaning & Brush DiscsCustom brush layout, density and disc geometry for controlled wet-process cleaning and debris removal.AVAILABLE PRODUCT TYPES
Products that may suit this application.
Final material, dimensions and configuration are confirmed for the order.NWS-CMC-2101NWS-CMC-2101 Metal and Epoxy Composite CarriersMetal and Epoxy Composite Carriers for wafers and precision optical parts. Double-sided lapping / polishing. Construction: Blue-steel or stainless-steel body with epoxy contact inserts; Thickness capability: From 0.25 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-LGP-2101NWS-LGP-2101 Ductile-Iron Lapping PlatesDuctile-Iron Lapping Plates for wafers, ceramics and precision parts. Lapping. Material grade: QT600 ductile iron; Dimensions: Diameter, thickness, mounting and grooves to drawing. Custom-made for the agreed process.View product →NWS-CDT-2101NWS-CDT-2101 Drawing-Controlled Conditioning WheelsDrawing-Controlled Conditioning Wheels for lapping plate surfaces. Plate conditioning. Material options: QT600 ductile iron / HT250 grey iron / 45-grade steel; Geometry: Drawing-controlled contact face, thickness and mounting. Custom-made for the agreed process.View product →NWS-PAD-2201NWS-PAD-2201 Nonwoven Substrate Lapping PadsNonwoven Substrate Lapping Pads for sic, sapphire, microcrystalline glass and ceramics. Coarse / intermediate polishing. Thickness options: 0.8 / 1.0 / 1.2 / 1.27 / 1.3 / 1.5 / 2.0 / 3.0 mm; Density range: 0.43–0.55 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2202NWS-PAD-2202 Microporous Damping-Cloth Finishing PadsMicroporous Damping-Cloth Finishing Pads for wafers, optical components, glass and metal. Fine polishing. Thickness options: 0.5 / 0.6 / 0.8 / 1.0 / 1.4 / 1.5 mm; Density range: 0.34–0.66 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2302NWS-PAD-2302 Nonwoven Wafer Pre-Polishing PadsNonwoven Wafer Pre-Polishing Pads for sic, gaas, silicon, sapphire and metal. Initial polishing. Thickness: 0.8–4.0 mm; Hardness: Shore A 35–92. Custom-made for the agreed process.View product →NWS-PAD-2303NWS-PAD-2303 Compliant Final-Polishing ClothCompliant Final-Polishing Cloth for sic, gaas, silicon, sapphire and glass. Final polishing. Thickness: 0.5–2.0 mm; Hardness: Shore A 32–65. Custom-made for the agreed process.View product →NWS-PAD-2501NWS-PAD-2501 Synthetic-Fibre Pads for Wafer LappingSynthetic-Fibre Pads for Wafer Lapping for sic, gan, gaas, inp, silicon and optical glass. Lapping / polishing. Typical thickness: 1.30 mm; Typical density: 0.43 g/cm³. Custom-made for the agreed process.View product →NWS-POL-5301NWS-POL-5301 Fine Diamond Slurry for SiC SubstratesFine Diamond Slurry for SiC Substrates for silicon carbide substrates. Fine grinding. Abrasive: Diamond; D50: 2.4 ± 0.1 µm. Custom-made for the agreed process.View product →NWS-POL-3401NWS-POL-3401 Polycrystalline Diamond Slurry GradesPolycrystalline Diamond Slurry Grades for sic, hard ceramics and optical materials. Lapping / polishing. Abrasive: Polycrystalline diamond; Nominal grade options: 3 / 4 / 6 µm. Custom-made for the agreed process.View product →NWS-POL-5501NWS-POL-5501 Fine Silica Slurry for SiC WafersFine Silica Slurry for SiC Wafers for silicon carbide wafers. Fine polishing. Abrasive: Colloidal silica; Particle-size reference: 42.13 nm. Custom-made for the agreed process.View product →Composite carrierMetal-Body Carriers with Polymer InsertsA rigid metal drive body with replaceable or integrated polymer contact zones around sensitive workpieces.View product →Machine family7DP–16B Lapping Carrier ReferencesA medium-machine review route covering common 7DP, 9B/DP/S, 10.5B, 11DP, 12B/DP/S, 13-series, 14DP, 15-series and 16B references.View product →Machine family16DP–32B Large-Machine Carrier ReferencesA large-format review route covering 16DP/S, 17B, 18B/S, 20B, 22B, 24B, 30B and 32B references.View product →Groove geometryRadial-Groove Lapping PlatesRadial channel layouts developed for liquid transport and debris evacuation on the specific plate and machine.View product →
APPLICATION QUOTATION
Send the product name, drawing or sample photo.
Request a quote →WORKPIECE & PROCESS FIT
SiC substrate lapping and polishing
4H/6H silicon carbide substrates and precision SiC parts.- What to specify
- Si-face or C-face, diameter, thickness, incoming damage and removal stage. Slurry abrasive size, concentration and chemistry are developed with the pad and process.
- Made-to-order consumables
- Carrier geometry and material, plate grooves, pad contact properties, conditioning, cleaning and polishing media are reviewed for the actual process. Drawing review and first-article support establish the repeat-order specification.