PRODUCT SYSTEM

Nine consumable families. One connected finishing route.

Start with the product you need, then connect it to the machine, workpiece, contact interface, chemistry and validation plan.
01Workholding & carriersComposite, metal, epoxy and engineering-polymer directions
02Process toolingLapping plates, grinding plates, conditioning and cleaning tools
03Contact materialsPolishing pads and waxless holding systems
04Process chemistrySlurries, compounds, paste, powder and abrasive routes
01Composite Lapping Carriers

Composite carrier

Composite Lapping Carriers

A precision metal drive body with engineered polymer contact zones for sensitive, brittle or high-value workpieces.View product engineering →
02Steel & Stainless Carriers

Metal carrier

Steel & Stainless Carriers

Thin metal carriers engineered around tooth engagement, dimensional control, wet-process compatibility and repeat loading.View product engineering →
03Epoxy & Resin Carriers

Polymer carrier

Epoxy & Resin Carriers

Application-led polymer and laminated carrier directions for contact-sensitive workholding and process development.View product engineering →
04Lapping & Grinding Plates

Process tooling

Lapping & Grinding Plates

Plate materials, groove patterns and abrasive routes matched to removal behaviour, slurry transport and target surface.View product engineering →
05Conditioning Rings & Wheels

Plate control

Conditioning Rings & Wheels

Drawing-based tools for plate correction, surface renewal and repeatable working-face preparation.View product engineering →
06Cleaning & Brush Discs

Cleaning

Cleaning & Brush Discs

Custom brush layout, density and disc geometry for controlled wet-process cleaning and debris removal.View product engineering →
07PU Polishing Pads

Contact materials

PU Polishing Pads

Groove, hardness, pore and liquid-retention directions selected around contact stability and target finish.View product engineering →
08Adsorption & Holding Pads

Waxless holding

Adsorption & Holding Pads

Waxless holding directions for stable location, protected contact and controlled release during processing.View product engineering →
09Slurries, Compounds & Abrasives

Process chemistry

Slurries, Compounds & Abrasives

Formulation-led polishing media matched to substrate, contact tool, delivery mode and target surface.View product engineering →