Optical Glass

Optical Glass Finishing

Application-specific pads, compounds and tooling for planar or shaped optical surfaces.

Discuss this application →All application routes

Application visual: Optical Glass material blanks — Application material visual

APPLICATION

Optical Glass Finishing

Scratch and figure control
Contact matched to geometry
Clean optical surface

PRODUCT AVAILABILITY

Custom products for the application.

Multiple product families
Custom materials and dimensions
Quotation from drawing, sample or requirement

SUPPLY SUPPORT

From samples to repeat orders.

Global quotation support
Sample and project communication
Repeat-order supply

AVAILABLE PRODUCT TYPES

Products that may suit this application.

Final material, dimensions and configuration are confirmed for the order.

NWS-MTC-2101NWS-MTC-2101 Thin Blue-Steel Lapping CarriersThin Blue-Steel Lapping Carriers for thin wafers, quartz and optical glass. Double-sided lapping. Material: Blue steel; Thickness capability: From 0.05 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-MTC-2102NWS-MTC-2102 Stainless-Steel Wafer CarriersStainless-Steel Wafer Carriers for wafers, quartz and optical components. Double-sided lapping / polishing. Material: Stainless steel; grade selected for the process; Thickness capability: From 0.05 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-PLC-2101NWS-PLC-2101 Epoxy-Laminate Thin-Part CarriersEpoxy-Laminate Thin-Part Carriers for optical glass and quartz parts. Double-sided polishing. Material: Epoxy laminate; Thickness capability: From 0.1 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-PLC-2102NWS-PLC-2102 PVC Drawing-Controlled CarriersPVC Drawing-Controlled Carriers for optical glass and thin brittle parts. Double-sided polishing. Material: PVC; Thickness capability: From 0.1 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-CMC-2101NWS-CMC-2101 Metal and Epoxy Composite CarriersMetal and Epoxy Composite Carriers for wafers and precision optical parts. Double-sided lapping / polishing. Construction: Blue-steel or stainless-steel body with epoxy contact inserts; Thickness capability: From 0.25 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-LGP-2102NWS-LGP-2102 Grey-Iron Lapping PlatesGrey-Iron Lapping Plates for wafers, glass and precision parts. Lapping. Material grade: HT250 grey iron; Dimensions: Diameter, thickness, mounting and grooves to drawing. Custom-made for the agreed process.View product →NWS-CDT-2101NWS-CDT-2101 Drawing-Controlled Conditioning WheelsDrawing-Controlled Conditioning Wheels for lapping plate surfaces. Plate conditioning. Material options: QT600 ductile iron / HT250 grey iron / 45-grade steel; Geometry: Drawing-controlled contact face, thickness and mounting. Custom-made for the agreed process.View product →NWS-PAD-2101NWS-PAD-2101 Ceria-Filled Optical Polishing PadsCeria-Filled Optical Polishing Pads for glass lenses and precision optical glass. Polishing. Hardness: Shore A 75–85; Density: 0.39–0.46 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2202NWS-PAD-2202 Microporous Damping-Cloth Finishing PadsMicroporous Damping-Cloth Finishing Pads for wafers, optical components, glass and metal. Fine polishing. Thickness options: 0.5 / 0.6 / 0.8 / 1.0 / 1.4 / 1.5 mm; Density range: 0.34–0.66 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2203NWS-PAD-2203 Zirconia-Filled Precision Optical PadsZirconia-Filled Precision Optical Pads for precision optical surfaces. Polishing. Filler: Zirconium oxide; Hardness: Shore A 90 ± 3. Custom-made for the agreed process.View product →NWS-PAD-2301NWS-PAD-2301 Foamed PU Pads for Glass WafersFoamed PU Pads for Glass Wafers for microcrystalline glass, glass wafers and prisms. Polishing. Outside diameter: 380–1300 mm; Thickness: 1–3 mm. Custom-made for the agreed process.View product →NWS-PAD-2501NWS-PAD-2501 Synthetic-Fibre Pads for Wafer LappingSynthetic-Fibre Pads for Wafer Lapping for sic, gan, gaas, inp, silicon and optical glass. Lapping / polishing. Typical thickness: 1.30 mm; Typical density: 0.43 g/cm³. Custom-made for the agreed process.View product →NWS-POL-3101NWS-POL-3101 Fine Ceria Slurry for Blue GlassFine Ceria Slurry for Blue Glass for blue-glass filters and soft optical glass. Fine polishing. Abrasive: Cerium oxide; D50: 0.10–0.14 µm. Custom-made for the agreed process.View product →NWS-POL-3102NWS-POL-3102 Concentrated Ceria Optical SlurryConcentrated Ceria Optical Slurry for optical glass and compatible glass substrates. Polishing. Abrasive: Cerium oxide; D50: 0.4–0.7 µm. Custom-made for the agreed process.View product →NWS-POL-3201NWS-POL-3201 Acidic Ceria Slurry for Glass WafersAcidic Ceria Slurry for Glass Wafers for glass wafers and precision optics. Fine polishing. Abrasive: Cerium oxide; Particle-size reference: 0.1–0.2 µm. Custom-made for the agreed process.View product →NWS-POL-3202NWS-POL-3202 Fine Ceria Slurry for Glass FinishingFine Ceria Slurry for Glass Finishing for glass wafers and optical glass. Fine polishing. Abrasive: Cerium oxide; Particle-size reference: 0.05–0.1 µm. Custom-made for the agreed process.View product →NWS-POL-3203NWS-POL-3203 Zirconia Slurry for Soft Optical GlassZirconia Slurry for Soft Optical Glass for soft optical glass, filters and camera lenses. Polishing. Abrasive: Zirconium oxide; Particle-size reference: 0.8–1.0 µm. Custom-made for the agreed process.View product →NWS-POL-3401NWS-POL-3401 Polycrystalline Diamond Slurry GradesPolycrystalline Diamond Slurry Grades for sic, hard ceramics and optical materials. Lapping / polishing. Abrasive: Polycrystalline diamond; Nominal grade options: 3 / 4 / 6 µm. Custom-made for the agreed process.View product →NWS-POL-3403NWS-POL-3403 Colloidal Silica Wafer-Polishing GradesColloidal Silica Wafer-Polishing Grades for semiconductor wafers and compatible precision surfaces. Fine polishing. Abrasive: Colloidal silica; Particle-size options: 80 / 100 / 120 nm. Custom-made for the agreed process.View product →NWS-POL-3601NWS-POL-3601 Ceria Slurry for Fibre Array UnitsCeria Slurry for Fibre Array Units for fau optical-communication components. Polishing. Abrasive: Cerium oxide; Particle-size reference: 0.104 µm. Custom-made for the agreed process.View product →NWS-POL-3604NWS-POL-3604 Silica Slurry for Lithium NiobateSilica Slurry for Lithium Niobate for lithium niobate optical and piezoelectric components. Polishing. Abrasive: Colloidal silica; Particle-size reference: 112.8 nm. Custom-made for the agreed process.View product →NWS-POL-3605NWS-POL-3605 Silica Slurry for Resin OpticsSilica Slurry for Resin Optics for resin lenses and optical resin parts. Fine polishing. Abrasive: Colloidal silica; Particle-size reference: 128.5 nm. Custom-made for the agreed process.View product →Protected contactEdge-Protection Composite CarriersComposite pocket interfaces developed for thin, brittle or high-value substrates where edge contact is the primary risk.View product →Laminate carrierG10 / FR4 Laminate CarriersMachined laminate carrier directions for protected contact and economical process development where their stiffness and chemistry fit.View product →Polymer carrierPOM, PA, PVC & Cast-Polymer CarriersApplication-led polymer workholding for contact-sensitive parts and defined chemical environments.View product →Machine family2B–6B Lapping Carrier ReferencesA small-machine review route covering legacy 2B, 2DP, 2S, 3B, 3DP, 3S, 4B, 5B/DP/S, 6B and 6DP references.View product →

APPLICATION QUOTATION

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WORKPIECE & PROCESS FIT

Optical glass, fused silica and prism polishing

Fused silica and quartz windows, optical prisms, mirrors, spherical and aspheric lenses, and cover-glass components.

What to specify: Specify flat, spherical, aspheric or freeform geometry. Planar planetary carriers are reviewed separately from curved-surface tools; share radius, surface figure and scratch-dig requirements where relevant.
Made-to-order consumables: Carrier geometry and material, plate grooves, pad contact properties, conditioning, cleaning and polishing media are reviewed for the actual process. Drawing review and first-article support establish the repeat-order specification.