Al₂O₃ · Sapphire

Sapphire Wafer Finishing

A hard, brittle substrate route connecting edge protection, removal rate, plate or pad choice and final surface control.

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Application visual: Al₂O₃ · Sapphire material blanks — Application material visual

APPLICATION

Sapphire Wafer Finishing

Chipping and edge-contact control
Efficient hard-material removal
Transition from lapping to polishing

PRODUCT AVAILABILITY

Custom products for the application.

Multiple product families
Custom materials and dimensions
Quotation from drawing, sample or requirement

SUPPLY SUPPORT

From samples to repeat orders.

Global quotation support
Sample and project communication
Repeat-order supply

AVAILABLE PRODUCT TYPES

Products that may suit this application.

Final material, dimensions and configuration are confirmed for the order.

NWS-MTC-2101NWS-MTC-2101 Thin Blue-Steel Lapping CarriersThin Blue-Steel Lapping Carriers for thin wafers, quartz and optical glass. Double-sided lapping. Material: Blue steel; Thickness capability: From 0.05 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-CMC-2101NWS-CMC-2101 Metal and Epoxy Composite CarriersMetal and Epoxy Composite Carriers for wafers and precision optical parts. Double-sided lapping / polishing. Construction: Blue-steel or stainless-steel body with epoxy contact inserts; Thickness capability: From 0.25 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-LGP-2101NWS-LGP-2101 Ductile-Iron Lapping PlatesDuctile-Iron Lapping Plates for wafers, ceramics and precision parts. Lapping. Material grade: QT600 ductile iron; Dimensions: Diameter, thickness, mounting and grooves to drawing. Custom-made for the agreed process.View product →NWS-PAD-2102NWS-PAD-2102 Hard Pads for Sapphire and CeramicsHard Pads for Sapphire and Ceramics for sapphire, ceramics and metal parts. Grinding / polishing. Hardness: Shore D 64–72; Density: 1.00–1.08 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2201NWS-PAD-2201 Nonwoven Substrate Lapping PadsNonwoven Substrate Lapping Pads for sic, sapphire, microcrystalline glass and ceramics. Coarse / intermediate polishing. Thickness options: 0.8 / 1.0 / 1.2 / 1.27 / 1.3 / 1.5 / 2.0 / 3.0 mm; Density range: 0.43–0.55 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2202NWS-PAD-2202 Microporous Damping-Cloth Finishing PadsMicroporous Damping-Cloth Finishing Pads for wafers, optical components, glass and metal. Fine polishing. Thickness options: 0.5 / 0.6 / 0.8 / 1.0 / 1.4 / 1.5 mm; Density range: 0.34–0.66 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2302NWS-PAD-2302 Nonwoven Wafer Pre-Polishing PadsNonwoven Wafer Pre-Polishing Pads for sic, gaas, silicon, sapphire and metal. Initial polishing. Thickness: 0.8–4.0 mm; Hardness: Shore A 35–92. Custom-made for the agreed process.View product →NWS-PAD-2303NWS-PAD-2303 Compliant Final-Polishing ClothCompliant Final-Polishing Cloth for sic, gaas, silicon, sapphire and glass. Final polishing. Thickness: 0.5–2.0 mm; Hardness: Shore A 32–65. Custom-made for the agreed process.View product →NWS-PAD-2401NWS-PAD-2401 Fixed-Diamond Pads for Hard SubstratesFixed-Diamond Pads for Hard Substrates for glass, microcrystalline glass, sapphire and ceramics. Fixed-abrasive grinding. Abrasive: Fixed diamond; Seamless diameter capability: Up to 1550 mm. Custom-made for the agreed process.View product →NWS-HLD-2101NWS-HLD-2101 Waxless Wafer Support PadsWaxless Wafer Support Pads for silicon, sapphire and compound-semiconductor wafers. Wafer holding. Typical thickness: 0.58 mm; Typical density: 0.57 g/cm³. Custom-made for the agreed process.View product →NWS-POL-3301NWS-POL-3301 Sapphire Final-Polishing Silica SlurrySapphire Final-Polishing Silica Slurry for sapphire substrates and optical windows. Precision polishing. Abrasive: Silicon dioxide; D50: 100 ± 20 nm. Custom-made for the agreed process.View product →NWS-POL-3302NWS-POL-3302 Single-Sided Sapphire Alumina SlurrySingle-Sided Sapphire Alumina Slurry for sapphire substrates. Single-sided polishing. Abrasive: Aluminum oxide; D50: 1.8 ± 0.1 µm. Custom-made for the agreed process.View product →NWS-POL-3303NWS-POL-3303 Double-Sided Sapphire Alumina SlurryDouble-Sided Sapphire Alumina Slurry for sapphire substrates. Double-sided polishing. Abrasive: Aluminum oxide; D50: 1.4 ± 0.1 µm. Custom-made for the agreed process.View product →NWS-POL-3403NWS-POL-3403 Colloidal Silica Wafer-Polishing GradesColloidal Silica Wafer-Polishing Grades for semiconductor wafers and compatible precision surfaces. Fine polishing. Abrasive: Colloidal silica; Particle-size options: 80 / 100 / 120 nm. Custom-made for the agreed process.View product →Composite carrierMetal-Body Carriers with Polymer InsertsA rigid metal drive body with replaceable or integrated polymer contact zones around sensitive workpieces.View product →Blue steelBlue-Steel Thin Workpiece CarriersThin single-sheet carriers for applications that need a stiff machine interface and drawing-controlled pockets.View product →Machine family7DP–16B Lapping Carrier ReferencesA medium-machine review route covering common 7DP, 9B/DP/S, 10.5B, 11DP, 12B/DP/S, 13-series, 14DP, 15-series and 16B references.View product →Groove geometryCross-Hatched Lapping PlatesCross-grooved plate faces for controlled abrasive distribution, contact renewal and debris transport.View product →

APPLICATION QUOTATION

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WORKPIECE & PROCESS FIT

Sapphire wafer and window polishing

Sapphire substrates, optical windows and thin double-side-polished plates.

What to specify: Crystal orientation, aperture, flatness, parallelism, edge chipping and surface finish; the carrier thickness follows the agreed workpiece process.
Made-to-order consumables: Carrier geometry and material, plate grooves, pad contact properties, conditioning, cleaning and polishing media are reviewed for the actual process. Drawing review and first-article support establish the repeat-order specification.