APPLICATION
Microcrystalline Glass Wafer Finishing
- Pocket and edge control
- Thickness uniformity
- Low-defect finish
Microglass
Microcrystalline Glass Wafer Finishing
A precision-glass route balancing pocket clearance, thickness control, edge risk and target finish.
PRODUCT AVAILABILITY
Custom products for the application.
- Multiple product families
- Custom materials and dimensions
- Quotation from drawing, sample or requirement
SUPPLY SUPPORT
From samples to repeat orders.
- Global quotation support
- Sample and project communication
- Repeat-order supply
RELATED CONSUMABLE DIRECTIONS
Products to review as one application-matched system.
Composite Lapping CarriersA precision metal drive body with engineered polymer contact zones for sensitive, brittle or high-value workpieces.
PU Polishing PadsGroove, hardness, pore and liquid-retention directions selected around contact stability and target finish.
Cleaning & Brush DiscsCustom brush layout, density and disc geometry for controlled wet-process cleaning and debris removal.AVAILABLE PRODUCT TYPES
Products that may suit this application.
Final material, dimensions and configuration are confirmed for the order.NWS-PLC-2101NWS-PLC-2101 Epoxy-Laminate Thin-Part CarriersEpoxy-Laminate Thin-Part Carriers for optical glass and quartz parts. Double-sided polishing. Material: Epoxy laminate; Thickness capability: From 0.1 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-PLC-2102NWS-PLC-2102 PVC Drawing-Controlled CarriersPVC Drawing-Controlled Carriers for optical glass and thin brittle parts. Double-sided polishing. Material: PVC; Thickness capability: From 0.1 mm; final thickness to drawing. Custom-made for the agreed process.View product →NWS-PAD-2101NWS-PAD-2101 Ceria-Filled Optical Polishing PadsCeria-Filled Optical Polishing Pads for glass lenses and precision optical glass. Polishing. Hardness: Shore A 75–85; Density: 0.39–0.46 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2201NWS-PAD-2201 Nonwoven Substrate Lapping PadsNonwoven Substrate Lapping Pads for sic, sapphire, microcrystalline glass and ceramics. Coarse / intermediate polishing. Thickness options: 0.8 / 1.0 / 1.2 / 1.27 / 1.3 / 1.5 / 2.0 / 3.0 mm; Density range: 0.43–0.55 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2202NWS-PAD-2202 Microporous Damping-Cloth Finishing PadsMicroporous Damping-Cloth Finishing Pads for wafers, optical components, glass and metal. Fine polishing. Thickness options: 0.5 / 0.6 / 0.8 / 1.0 / 1.4 / 1.5 mm; Density range: 0.34–0.66 g/cm³. Custom-made for the agreed process.View product →NWS-PAD-2301NWS-PAD-2301 Foamed PU Pads for Glass WafersFoamed PU Pads for Glass Wafers for microcrystalline glass, glass wafers and prisms. Polishing. Outside diameter: 380–1300 mm; Thickness: 1–3 mm. Custom-made for the agreed process.View product →NWS-PAD-2303NWS-PAD-2303 Compliant Final-Polishing ClothCompliant Final-Polishing Cloth for sic, gaas, silicon, sapphire and glass. Final polishing. Thickness: 0.5–2.0 mm; Hardness: Shore A 32–65. Custom-made for the agreed process.View product →NWS-PAD-2401NWS-PAD-2401 Fixed-Diamond Pads for Hard SubstratesFixed-Diamond Pads for Hard Substrates for glass, microcrystalline glass, sapphire and ceramics. Fixed-abrasive grinding. Abrasive: Fixed diamond; Seamless diameter capability: Up to 1550 mm. Custom-made for the agreed process.View product →NWS-POL-3102NWS-POL-3102 Concentrated Ceria Optical SlurryConcentrated Ceria Optical Slurry for optical glass and compatible glass substrates. Polishing. Abrasive: Cerium oxide; D50: 0.4–0.7 µm. Custom-made for the agreed process.View product →NWS-POL-3201NWS-POL-3201 Acidic Ceria Slurry for Glass WafersAcidic Ceria Slurry for Glass Wafers for glass wafers and precision optics. Fine polishing. Abrasive: Cerium oxide; Particle-size reference: 0.1–0.2 µm. Custom-made for the agreed process.View product →NWS-POL-3202NWS-POL-3202 Fine Ceria Slurry for Glass FinishingFine Ceria Slurry for Glass Finishing for glass wafers and optical glass. Fine polishing. Abrasive: Cerium oxide; Particle-size reference: 0.05–0.1 µm. Custom-made for the agreed process.View product →Protected contactEdge-Protection Composite CarriersComposite pocket interfaces developed for thin, brittle or high-value substrates where edge contact is the primary risk.View product →Polymer carrierPOM, PA, PVC & Cast-Polymer CarriersApplication-led polymer workholding for contact-sensitive parts and defined chemical environments.View product →Machine family2B–6B Lapping Carrier ReferencesA small-machine review route covering legacy 2B, 2DP, 2S, 3B, 3DP, 3S, 4B, 5B/DP/S, 6B and 6DP references.View product →Low-hardness plateGlass Lapping PlatesPlain or grooved glass-plate directions for selected softer compound-semiconductor and optical finishing routes.View product →
APPLICATION QUOTATION
Send the product name, drawing or sample photo.
Request a quote →WORKPIECE & PROCESS FIT
Glass wafer and glass-ceramic finishing
Glass wafers, glass-ceramic plates and glass substrates for through-glass-via (TGV) process development.- What to specify
- Glass composition, thickness, hole state, flatness, warp, surface damage and cleaning. Separate pre-via polishing from finishing an already perforated substrate.
- Made-to-order consumables
- Carrier geometry and material, plate grooves, pad contact properties, conditioning, cleaning and polishing media are reviewed for the actual process. Drawing review and first-article support establish the repeat-order specification.