SELECTION FOCUS
Questions that change the direction.
- Silicon, sapphire and compound-semiconductor wafers
- Wafer holding
- Confirm wafer backside, wetting, pressure and release method; a holding pad is not the abrasive polishing face.
NWS-HLD-2101 · Adsorption & Holding Pads
NWS-HLD-2101 Waxless Wafer Support Pads
Waxless Wafer Support Pads for silicon, sapphire and compound-semiconductor wafers. Wafer holding. Typical thickness: 0.58 mm; Typical density: 0.57 g/cm³. Custom-made for the agreed process.
HOW THIS PRODUCT IS JUDGED
Connect the physical product to its process function.
Confirm wafer backside, wetting, pressure and release method; a holding pad is not the abrasive polishing face.PRODUCT IDENTITY & CONFIGURATION
NWS-HLD-2101
NewwaySmart application-selected grade · Made to order · Sample and first-article supportTypical selection data, not a universal performance guarantee. Ranges represent grade options; not every combination is available. Final dimensions or formulation and batch acceptance are agreed for the order.Silicon, sapphire and compound-semiconductor wafersWafer holding
- Typical thicknessreference
- 0.58 mm
- Typical densityreference
- 0.57 g/cm³
- Configurationreference
- Drawing-defined outline and support pockets
- 01Confirm the workpiece and process stage.
- 02Select the pad, plate, carrier and chemistry as a matched system.
- 03Agree the sample specification and acceptance method.
- 04Release the order specification after the agreed application trial.
RFQ & DRAWING FIELDS
Evidence needed before release.
- Workpiece material, dimensions and incoming surface
- Machine, pad or plate, pressure, speed and liquid delivery
- Required finish, removal allowance and inspection method
- Quantity, sample requirement and final specification
ORDER CONFIGURATION
Made for your process.
Select the grade, custom dimensions or formulation, packaging and sample quantity. The family image illustrates the product type; the order specification defines the supplied product.Do not submit confidential customer drawings until a secure project channel is confirmed.PUBLIC CLAIM BOUNDARY
Typical direction is not a performance guarantee.
Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.
APPLICATION ROUTES
Where this product may enter the process.
ENGINEERING KNOWLEDGE
Read before selecting the specification.
RELATED TYPES IN ADSORPTION & HOLDING PADS
Compare neighbouring constructions.
Waxless holdingWaxless Wafer Holding PadsHolding-pad directions for stable planar support, protected contact and controlled release without wax.Holding templateThin-Substrate Holding TemplatesTemplate and contact-layer systems for locating thin wafers, glass and precision parts on a supporting platen.
DRAWING · SAMPLE · PROCESS EVIDENCE