NWS-HLD-2101 · Adsorption & Holding Pads
NWS-HLD-2101 Waxless Wafer Support Pads
Waxless Wafer Support Pads for silicon, sapphire and compound-semiconductor wafers. Wafer holding. Typical thickness: 0.58 mm; Typical density: 0.57 g/cm³. Custom-made for the agreed process.
APPLICATIONS
Where this product may be supplied.
CUSTOM SUPPLY
Made to the confirmed order specification.
RELATED TYPES IN ADSORPTION & HOLDING PADS
Compare neighbouring constructions.
Waxless holdingWaxless Wafer Holding PadsHolding-pad directions for stable planar support, protected contact and controlled release without wax.Holding templateThin-Substrate Holding TemplatesTemplate and contact-layer systems for locating thin wafers, glass and precision parts on a supporting platen.
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