SELECTION FOCUS
Questions that change the direction.
- Semiconductor wafers and compatible precision surfaces
- Fine polishing
- Release a specific grade with agreed pH, solids and particle distribution after the application review.
NWS-POL-3403 · Slurries, Compounds & Abrasives
NWS-POL-3403 Colloidal Silica Wafer-Polishing Grades
Colloidal Silica Wafer-Polishing Grades for semiconductor wafers and compatible precision surfaces. Fine polishing. Abrasive: Colloidal silica; Particle-size options: 80 / 100 / 120 nm. Custom-made for the agreed process.
HOW THIS PRODUCT IS JUDGED
Connect the physical product to its process function.
Release a specific grade with agreed pH, solids and particle distribution after the application review.PRODUCT IDENTITY & CONFIGURATION
NWS-POL-3403
NewwaySmart application-selected grade · Made to order · Sample and first-article supportTypical selection data, not a universal performance guarantee. Ranges represent grade options; not every combination is available. Final dimensions or formulation and batch acceptance are agreed for the order.Semiconductor wafers and compatible precision surfacesFine polishing
- Abrasivereference
- Colloidal silica
- Particle-size optionsreference
- 80 / 100 / 120 nm
- Solids rangereference
- 15–45 wt% across grades
- Formulation pH rangereference
- 3–12 across grades
- 01Confirm the workpiece and process stage.
- 02Select the pad, plate, carrier and chemistry as a matched system.
- 03Agree the sample specification and acceptance method.
- 04Release the order specification after the agreed application trial.
RFQ & DRAWING FIELDS
Evidence needed before release.
- Workpiece material, dimensions and incoming surface
- Machine, pad or plate, pressure, speed and liquid delivery
- Required finish, removal allowance and inspection method
- Quantity, sample requirement and final specification
ORDER CONFIGURATION
Made for your process.
Select the grade, custom dimensions or formulation, packaging and sample quantity. The family image illustrates the product type; the order specification defines the supplied product.Do not submit confidential customer drawings until a secure project channel is confirmed.PUBLIC CLAIM BOUNDARY
Typical direction is not a performance guarantee.
Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.
APPLICATION ROUTES
Where this product may enter the process.
ENGINEERING KNOWLEDGE
Read before selecting the specification.
RELATED TYPES IN SLURRIES, COMPOUNDS & ABRASIVES
Compare neighbouring constructions.
Diamond slurryMonocrystalline Diamond SlurriesDiamond-slurry directions for controlled lapping and polishing where cutting action, suspension and surface target are matched.Diamond slurryPolycrystalline Diamond SlurriesPolycrystalline-diamond suspension directions for fine removal and surface refinement on compatible hard materials.Silica slurryColloidal Silica Polishing SlurriesChemistry-led silica-slurry directions for fine polishing of selected wafers, glass and ceramics.Alumina slurryAlumina Polishing SlurriesAlumina-abrasive slurry directions for selected metal, ceramic and substrate finishing steps.
DRAWING · SAMPLE · PROCESS EVIDENCE