NWS-PAD-2501 · PU Polishing Pads
NWS-PAD-2501 Synthetic-Fibre Pads for Wafer Lapping
Synthetic-Fibre Pads for Wafer Lapping for sic, gan, gaas, inp, silicon and optical glass. Lapping / polishing. Typical thickness: 1.30 mm; Typical density: 0.43 g/cm³. Custom-made for the agreed process.
APPLICATIONS
Where this product may be supplied.
CUSTOM SUPPLY
Made to the confirmed order specification.
RELATED TYPES IN PU POLISHING PADS
Compare neighbouring constructions.
PU padPolyurethane Polishing PadsHardness, pore structure and groove directions selected around contact stability, slurry transport and target finish.Soft polishing clothSilk Polishing ClothsSoft contact-cloth directions for selected fine-polishing and final-surface applications.Napped clothSynthetic Velvet Polishing ClothsNapped polishing-cloth directions for applications needing compliant contact and controlled liquid retention.Coated abrasiveDiamond Lapping & Polishing FilmsPrecision coated-abrasive films selected by backing, diamond type, grade and format for controlled fine finishing.
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