NewwaySmart — Lapping, Grinding and Polishing
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NWS-PAD-2501 · PU Polishing Pads

NWS-PAD-2501 Synthetic-Fibre Pads for Wafer Lapping

Synthetic-Fibre Pads for Wafer Lapping for sic, gan, gaas, inp, silicon and optical glass. Lapping / polishing. Typical thickness: 1.30 mm; Typical density: 0.43 g/cm³. Custom-made for the agreed process.
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PU Polishing Pads family reference; not the exact NWS-PAD-2501 Synthetic-Fibre Pads for Wafer Lapping configuration
Product-family reference. Geometry and materials are defined for the order.

HOW THIS PRODUCT IS JUDGED

Connect the physical product to its process function.

Pair with a workpiece-specific diamond or oxide slurry; hardness scale is not substituted for Shore A.

PRODUCT IDENTITY & CONFIGURATION

NWS-PAD-2501

NewwaySmart application-selected grade · Made to order · Sample and first-article supportTypical selection data, not a universal performance guarantee. Ranges represent grade options; not every combination is available. Final dimensions or formulation and batch acceptance are agreed for the order.
SiC, GaN, GaAs, InP, silicon and optical glassLapping / polishing
Typical thicknessreference
1.30 mm
Typical densityreference
0.43 g/cm³
Configurationreference
Custom grooves and pressure-sensitive backing
  1. 01Confirm the workpiece and process stage.
  2. 02Select the pad, plate, carrier and chemistry as a matched system.
  3. 03Agree the sample specification and acceptance method.
  4. 04Release the order specification after the agreed application trial.

SELECTION FOCUS

Questions that change the direction.

  • SiC, GaN, GaAs, InP, silicon and optical glass
  • Lapping / polishing
  • Pair with a workpiece-specific diamond or oxide slurry; hardness scale is not substituted for Shore A.

RFQ & DRAWING FIELDS

Evidence needed before release.

  • Workpiece material, dimensions and incoming surface
  • Machine, pad or plate, pressure, speed and liquid delivery
  • Required finish, removal allowance and inspection method
  • Quantity, sample requirement and final specification

ORDER CONFIGURATION

Made for your process.

Select the grade, custom dimensions or formulation, packaging and sample quantity. The family image illustrates the product type; the order specification defines the supplied product.Do not submit confidential customer drawings until a secure project channel is confirmed.

PUBLIC CLAIM BOUNDARY

Typical direction is not a performance guarantee.

Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.

APPLICATION ROUTES

Where this product may enter the process.

ENGINEERING KNOWLEDGE

Read before selecting the specification.

RELATED TYPES IN PU POLISHING PADS

Compare neighbouring constructions.

PU padPolyurethane Polishing PadsHardness, pore structure and groove directions selected around contact stability, slurry transport and target finish.Soft polishing clothSilk Polishing ClothsSoft contact-cloth directions for selected fine-polishing and final-surface applications.Napped clothSynthetic Velvet Polishing ClothsNapped polishing-cloth directions for applications needing compliant contact and controlled liquid retention.Coated abrasiveDiamond Lapping & Polishing FilmsPrecision coated-abrasive films selected by backing, diamond type, grade and format for controlled fine finishing.

DRAWING · SAMPLE · PROCESS EVIDENCE

Start with what is known. Keep assumptions visible.

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