SELECTION FOCUS
Questions that change the direction.
- Wafer size and fragility
- Holding and release behaviour
- Flatness and backside marking
Waxless holding · Adsorption & Holding Pads
Waxless Wafer Holding Pads
Holding-pad directions for stable planar support, protected contact and controlled release without wax.
HOW THIS PRODUCT IS JUDGED
Connect the physical product to its process function.
Pore, surface, backing and wetting behaviour are evaluated with wafer thickness, process load and release method.RFQ & DRAWING FIELDS
Evidence needed before release.
- Pad size/thickness/backing
- Surface and pore direction
- Mounting and liquid
- Holding/release validation
PRODUCT REFERENCE
Confirm the configuration for your part.
Pad dry/wet, pore macro, wafer held and released, plus backside inspection.Do not submit confidential customer drawings until a secure project channel is confirmed.PUBLIC CLAIM BOUNDARY
Typical direction is not a performance guarantee.
Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.
APPLICATION ROUTES
Where this product may enter the process.
ENGINEERING KNOWLEDGE
Read before selecting the specification.
RELATED TYPES IN ADSORPTION & HOLDING PADS
Compare neighbouring constructions.
Holding templateThin-Substrate Holding TemplatesTemplate and contact-layer systems for locating thin wafers, glass and precision parts on a supporting platen.NWS-HLD-2101NWS-HLD-2101 Waxless Wafer Support PadsWaxless Wafer Support Pads for silicon, sapphire and compound-semiconductor wafers. Wafer holding. Typical thickness: 0.58 mm; Typical density: 0.57 g/cm³. Custom-made for the agreed process.
DRAWING · SAMPLE · PROCESS EVIDENCE