NWS-PAD-2302 · PU Polishing Pads
NWS-PAD-2302 Nonwoven Wafer Pre-Polishing Pads
Nonwoven Wafer Pre-Polishing Pads for sic, gaas, silicon, sapphire and metal. Initial polishing. Thickness: 0.8–4.0 mm; Hardness: Shore A 35–92. Custom-made for the agreed process.
APPLICATIONS
Where this product may be supplied.
CUSTOM SUPPLY
Made to the confirmed order specification.
RELATED TYPES IN PU POLISHING PADS
Compare neighbouring constructions.
PU padPolyurethane Polishing PadsHardness, pore structure and groove directions selected around contact stability, slurry transport and target finish.Soft polishing clothSilk Polishing ClothsSoft contact-cloth directions for selected fine-polishing and final-surface applications.Napped clothSynthetic Velvet Polishing ClothsNapped polishing-cloth directions for applications needing compliant contact and controlled liquid retention.Coated abrasiveDiamond Lapping & Polishing FilmsPrecision coated-abrasive films selected by backing, diamond type, grade and format for controlled fine finishing.
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