SELECTION FOCUS
Questions that change the direction.
- SiC, GaAs, silicon, sapphire and metal
- Initial polishing
- Match abrasive size to incoming damage and follow with a separate fine-polishing route.
NWS-PAD-2302 · PU Polishing Pads
NWS-PAD-2302 Nonwoven Wafer Pre-Polishing Pads
Nonwoven Wafer Pre-Polishing Pads for sic, gaas, silicon, sapphire and metal. Initial polishing. Thickness: 0.8–4.0 mm; Hardness: Shore A 35–92. Custom-made for the agreed process.
HOW THIS PRODUCT IS JUDGED
Connect the physical product to its process function.
Match abrasive size to incoming damage and follow with a separate fine-polishing route.PRODUCT IDENTITY & CONFIGURATION
NWS-PAD-2302
NewwaySmart application-selected grade · Made to order · Sample and first-article supportTypical selection data, not a universal performance guarantee. Ranges represent grade options; not every combination is available. Final dimensions or formulation and batch acceptance are agreed for the order.SiC, GaAs, silicon, sapphire and metalInitial polishing
- Thicknessreference
- 0.8–4.0 mm
- Hardnessreference
- Shore A 35–92
- Formatreference
- Custom-cut disc or sheet
- 01Confirm the workpiece and process stage.
- 02Select the pad, plate, carrier and chemistry as a matched system.
- 03Agree the sample specification and acceptance method.
- 04Release the order specification after the agreed application trial.
RFQ & DRAWING FIELDS
Evidence needed before release.
- Workpiece material, dimensions and incoming surface
- Machine, pad or plate, pressure, speed and liquid delivery
- Required finish, removal allowance and inspection method
- Quantity, sample requirement and final specification
ORDER CONFIGURATION
Made for your process.
Select the grade, custom dimensions or formulation, packaging and sample quantity. The family image illustrates the product type; the order specification defines the supplied product.Do not submit confidential customer drawings until a secure project channel is confirmed.PUBLIC CLAIM BOUNDARY
Typical direction is not a performance guarantee.
Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.
APPLICATION ROUTES
Where this product may enter the process.
ENGINEERING KNOWLEDGE
Read before selecting the specification.
RELATED TYPES IN PU POLISHING PADS
Compare neighbouring constructions.
PU padPolyurethane Polishing PadsHardness, pore structure and groove directions selected around contact stability, slurry transport and target finish.Soft polishing clothSilk Polishing ClothsSoft contact-cloth directions for selected fine-polishing and final-surface applications.Napped clothSynthetic Velvet Polishing ClothsNapped polishing-cloth directions for applications needing compliant contact and controlled liquid retention.Coated abrasiveDiamond Lapping & Polishing FilmsPrecision coated-abrasive films selected by backing, diamond type, grade and format for controlled fine finishing.
DRAWING · SAMPLE · PROCESS EVIDENCE