SELECTION FOCUS
Questions that change the direction.
- Wafers, ceramics and precision parts
- Lapping
- Match loose abrasive, slurry delivery and plate-conditioning plan.
NWS-LGP-2101 · Lapping & Grinding Plates
NWS-LGP-2101 Ductile-Iron Lapping Plates
Ductile-Iron Lapping Plates for wafers, ceramics and precision parts. Lapping. Material grade: QT600 ductile iron; Dimensions: Diameter, thickness, mounting and grooves to drawing. Custom-made for the agreed process.
HOW THIS PRODUCT IS JUDGED
Connect the physical product to its process function.
Match loose abrasive, slurry delivery and plate-conditioning plan.PRODUCT IDENTITY & CONFIGURATION
NWS-LGP-2101
NewwaySmart application-selected grade · Made to order · Sample and first-article supportTypical selection data, not a universal performance guarantee. Ranges represent grade options; not every combination is available. Final dimensions or formulation and batch acceptance are agreed for the order.Wafers, ceramics and precision partsLapping
- Material gradereference
- QT600 ductile iron
- Dimensionsreference
- Diameter, thickness, mounting and grooves to drawing
- 01Confirm the workpiece and process stage.
- 02Select the pad, plate, carrier and chemistry as a matched system.
- 03Agree the sample specification and acceptance method.
- 04Release the order specification after the agreed application trial.
RFQ & DRAWING FIELDS
Evidence needed before release.
- Workpiece material, dimensions and incoming surface
- Machine, pad or plate, pressure, speed and liquid delivery
- Required finish, removal allowance and inspection method
- Quantity, sample requirement and final specification
ORDER CONFIGURATION
Made for your process.
Select the grade, custom dimensions or formulation, packaging and sample quantity. The family image illustrates the product type; the order specification defines the supplied product.Do not submit confidential customer drawings until a secure project channel is confirmed.PUBLIC CLAIM BOUNDARY
Typical direction is not a performance guarantee.
Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.
APPLICATION ROUTES
Where this product may enter the process.
ENGINEERING KNOWLEDGE
Read before selecting the specification.
RELATED TYPES IN LAPPING & GRINDING PLATES
Compare neighbouring constructions.
Free-abrasive plateCast-Iron Lapping PlatesCast-iron working plates for free-abrasive lapping routes where plate condition, charging, groove and conditioning are controlled.Groove geometryRadial-Groove Lapping PlatesRadial channel layouts developed for liquid transport and debris evacuation on the specific plate and machine.Groove geometryCross-Hatched Lapping PlatesCross-grooved plate faces for controlled abrasive distribution, contact renewal and debris transport.Low-hardness plateGlass Lapping PlatesPlain or grooved glass-plate directions for selected softer compound-semiconductor and optical finishing routes.
DRAWING · SAMPLE · PROCESS EVIDENCE