NWS-POL-5301 · Slurries, Compounds & Abrasives
NWS-POL-5301 Fine Diamond Slurry for SiC Substrates
Fine Diamond Slurry for SiC Substrates for silicon carbide substrates. Fine grinding. Abrasive: Diamond; D50: 2.4 ± 0.1 µm. Custom-made for the agreed process.
APPLICATIONS
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CUSTOM SUPPLY
Made to the confirmed order specification.
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