SELECTION FOCUS
Questions that change the direction.
- 4H/6H polytype, diameter and face
- Incoming damage and target surface
- Pad/plate, pressure, speed, flow and temperature
Application-coded slurry · Slurries, Compounds & Abrasives
NWS-POL-5000 SiC-Wafer Polishing Slurry
A 4H/6H silicon-carbide wafer polishing formulation route controlled by wafer face, incoming condition, pad, machine and approved metrology.
HOW THIS PRODUCT IS JUDGED
Connect the physical product to its process function.
Si-face and C-face behaviour can differ. Numerical surface or removal claims are therefore published only with face-specific process conditions and an approved repeatable validation report.PRODUCT IDENTITY & CONFIGURATION
NWS-POL-5000
Existing NewwaySmart model retained; application target = 4H/6H SiC wafer polishingThe supplied bottle label is a draft reference. Exact roughness and removal values remain internal until the evidence package is approved.4H-SiC configuration6H-SiC configuration
- Target substrateconfirmed
- 4H / 6H silicon-carbide wafer route
- Wafer faceverify
- Si-face / C-face must be identified with orientation and incoming condition
- Abrasive / solids / pHverify
- Batch specification and approved COA required before publication
- Performance fieldsverify
- Removal and surface data require face-specific conditions, metrology and approved report
- 01Confirm polytype, face, diameter, thickness and incoming damage.
- 02Record pad/plate, pressure, speed, flow, temperature and cleaning.
- 03Approve batch specification and COA fields.
- 04Publish face-specific results only after repeatable validation.
RFQ & DRAWING FIELDS
Evidence needed before release.
- Released product and batch specification
- Abrasive, solids, pH and filtration
- Pack, lot, storage and shelf life
- Face-specific removal/surface report
PRODUCT REFERENCE
Confirm the configuration for your part.
Own-labelled NWS-POL-5000 bottle front/back, liquid appearance, lot code, sealed pack and approved face-specific COA/report fields.Do not submit confidential customer drawings until a secure project channel is confirmed.PUBLIC CLAIM BOUNDARY
Typical direction is not a performance guarantee.
Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.
APPLICATION ROUTES
Where this product may enter the process.
ENGINEERING KNOWLEDGE
Read before selecting the specification.
RELATED TYPES IN SLURRIES, COMPOUNDS & ABRASIVES
Compare neighbouring constructions.
Diamond slurryMonocrystalline Diamond SlurriesDiamond-slurry directions for controlled lapping and polishing where cutting action, suspension and surface target are matched.Diamond slurryPolycrystalline Diamond SlurriesPolycrystalline-diamond suspension directions for fine removal and surface refinement on compatible hard materials.Silica slurryColloidal Silica Polishing SlurriesChemistry-led silica-slurry directions for fine polishing of selected wafers, glass and ceramics.Alumina slurryAlumina Polishing SlurriesAlumina-abrasive slurry directions for selected metal, ceramic and substrate finishing steps.
DRAWING · SAMPLE · PROCESS EVIDENCE