SELECTION FOCUS
Questions that change the direction.
- Compound-semiconductor workpieces
- Fine polishing
- Particle size, pH and concentration are selected together, not independently guaranteed combinations.
NWS-POL-3402 · Slurries, Compounds & Abrasives
NWS-POL-3402 Fine Alumina Slurry for Compound Semiconductors
Fine Alumina Slurry for Compound Semiconductors for compound-semiconductor workpieces. Fine polishing. Abrasive: Aluminum oxide; Particle-size range: 0.05–0.8 µm across grades. Custom-made for the agreed process.
HOW THIS PRODUCT IS JUDGED
Connect the physical product to its process function.
Particle size, pH and concentration are selected together, not independently guaranteed combinations.PRODUCT IDENTITY & CONFIGURATION
NWS-POL-3402
NewwaySmart application-selected grade · Made to order · Sample and first-article supportTypical selection data, not a universal performance guarantee. Ranges represent grade options; not every combination is available. Final dimensions or formulation and batch acceptance are agreed for the order.Compound-semiconductor workpiecesFine polishing
- Abrasivereference
- Aluminum oxide
- Particle-size rangereference
- 0.05–0.8 µm across grades
- Formulation pH rangereference
- 4–12 across grades
- Concentration rangereference
- 10–30% across grades
- 01Confirm the workpiece and process stage.
- 02Select the pad, plate, carrier and chemistry as a matched system.
- 03Agree the sample specification and acceptance method.
- 04Release the order specification after the agreed application trial.
RFQ & DRAWING FIELDS
Evidence needed before release.
- Workpiece material, dimensions and incoming surface
- Machine, pad or plate, pressure, speed and liquid delivery
- Required finish, removal allowance and inspection method
- Quantity, sample requirement and final specification
ORDER CONFIGURATION
Made for your process.
Select the grade, custom dimensions or formulation, packaging and sample quantity. The family image illustrates the product type; the order specification defines the supplied product.Do not submit confidential customer drawings until a secure project channel is confirmed.PUBLIC CLAIM BOUNDARY
Typical direction is not a performance guarantee.
Dimensions, materials, removal rate, roughness, life and compatibility are published only when supported by an approved drawing, material record or project-specific validation. Unverified label examples, third-party photographs and customer pricing remain internal references.
APPLICATION ROUTES
Where this product may enter the process.
ENGINEERING KNOWLEDGE
Read before selecting the specification.
RELATED TYPES IN SLURRIES, COMPOUNDS & ABRASIVES
Compare neighbouring constructions.
Diamond slurryMonocrystalline Diamond SlurriesDiamond-slurry directions for controlled lapping and polishing where cutting action, suspension and surface target are matched.Diamond slurryPolycrystalline Diamond SlurriesPolycrystalline-diamond suspension directions for fine removal and surface refinement on compatible hard materials.Silica slurryColloidal Silica Polishing SlurriesChemistry-led silica-slurry directions for fine polishing of selected wafers, glass and ceramics.Alumina slurryAlumina Polishing SlurriesAlumina-abrasive slurry directions for selected metal, ceramic and substrate finishing steps.
DRAWING · SAMPLE · PROCESS EVIDENCE